Introduction

Nanotechnology thermal paste for maximizing heat dissipation from VGA, CPU, or LEDs. Provides superior protection against CPU heat damage and system stability compared to other standard thermal pastes.

Specifications

• 3g thermal paste syringe with spatula
• Thermal conductivity: > 4.5 W/m °C
• Thermal resistance: <0.205°C-in2/W
• Specific gravity: > 2.5
• Evaporation: <0.001%.
• Bleeding: <0.05%.
• Dielectric constant: > 5.1
• Dissipation factor A: <0.005
• Viscosity: 76 CPS
• Thixotropic index: 310 ± 10°C
• Operating temperature: -50 ~ 240°C
• Ingredients: Silicon compounds: 50%, Carbon compounds: 30%, Metal oxide compounds: 20%.